Quick Details:3mil/3mil, HDI , Impedance control, Half Holes
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Base Material
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Fr4 TG170
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Board Thickness
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mm
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Copper Thickness
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1OZ(outer) , (inter)
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Min. Hole Size
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4mil ()
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Min. Line Width/ Spacing
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3mil ()/3mil ()
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Solder mask Color
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Blue
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Silkscreen Color
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White
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Surface Finishing
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Immersion Gold
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of Order
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No MOQ
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Certificate
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UL, ISO 9001, ISO 14001
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HDI Step
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1+4+1
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Impedance control
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50 ohms, 100 ohms
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Difficulty
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1 Step HDI + Impedance control + Half Holes
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