Quick Details:3mil/3mil, HDI , Impedance control, Half Holes
|
Base Material |
Fr4 TG170 |
|
Board Thickness |
mm |
|
Copper Thickness |
1OZ(outer) , (inter) |
|
Min. Hole Size |
4mil () |
|
Min. Line Width/ Spacing |
3mil ()/3mil () |
|
Solder mask Color |
Blue |
|
Silkscreen Color |
White |
|
Surface Finishing |
Immersion Gold |
|
of Order |
No MOQ |
|
Certificate |
UL, ISO 9001, ISO 14001 |
|
HDI Step |
1+4+1 |
|
Impedance control |
50 ohms, 100 ohms |
|
Difficulty |
1 Step HDI + Impedance control + Half Holes |